π§ͺ Reliable Medium-Temperature Soldering β Polartronix Leaded Solder Paste is formulated with a Sn63/Pb37 alloy for a consistent 183Β°C melting point, delivering strong, dependable joints for everyday PCB, SMD, and BGA rework.
π‘οΈ 183Β°C Melting Point β The classic Sn63/Pb37 eutectic ratio offers a smooth, predictable melt and solidification curve, ideal for technicians who want proven, consistent soldering performance.
π§ Low-Residue Flux Formula β Built-in low-residue flux ensures smooth solder flow and clean joints, minimizing cleanup after soldering.
π 35g Syringe with Plunger & Blunt Needle Tip β Comes in a 35g syringe with an integrated plunger and blunt needle tip for smooth, controlled, drip-free dispensing directly onto pads and components.
π― Versatile Repair Applications β Suited for BGA reballing, chip-level rework, SMD component soldering, and general PCB repair across smartphones, tablets, and electronic devices.
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Key Features:
Sn63/Pb37 leaded alloy composition
Medium-temperature 183Β°C melting point
35g syringe with plunger for smooth dispensing
Blunt needle tip for precise application
Low-residue flux for clean, smooth flow
Ideal for BGA rework, SMD & PCB soldering
π― Built for Professionals β A dependable choice for micro-soldering technicians and board-level repair specialists who need consistent results at a proven melting temperature.
π‘ Whether you're reballing a BGA chip or handling everyday SMD rework, Polartronix Sn63Pb37 Leaded Solder Paste (SP-102) delivers smooth flow and reliable joints every time.