Polartronix Sn42Bi58 Lead-Free Low-Temperature BGA Solder Paste – 138°C Melting Point, 38g Syringe (SP-101)

🧪 Low-Temperature Precision Soldering — Polartronix Lead-Free Low-Melt Solder Paste is formulated with a Sn42/Bi58 alloy for a low 138°C melting point, ideal for heat-sensitive BGA rework and reballing jobs.
🌡️ 138°C Melting Point — The low-melt formula reduces thermal stress on PCBs and components, minimizing the risk of warping, pad lifting, or damage to sensitive parts during reflow.
♻️ Lead-Free Formula — A safer, RoHS-compliant alternative to traditional leaded solder paste, without compromising on reliable, consistent solder joints.
🎯 BGA & Fine-Pitch Ready — Specially suited for BGA reballing, chip-level repair, and fine-pitch component soldering where precise, low-heat application is critical.
💉 38g Syringe Application — Comes in a convenient 38g syringe for controlled, mess-free dispensing directly onto pads and components.

✅ Key Features:

Sn42/Bi58 lead-free alloy composition
Low 138°C melting point
38g syringe for precise dispensing
Ideal for BGA reballing & rework
Reduces thermal damage to sensitive boards
RoHS-compliant, safer soldering solution

🎯 Built for Professionals — A go-to solder paste for micro-soldering technicians and BGA rework specialists who need reliable results at lower temperatures.
📦 Wholesale Ready — Stock up for your repair shop or resale business with bulk ordering options.
💡 Whether you're reballing a BGA chip or reworking heat-sensitive components, Polartronix Lead-Free Low-Melt Solder Paste Sn42Bi58 (SP-101) gives you clean, reliable joints without the thermal risk.